Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD AND APPARATUS FOR WIREDRAWING METALLIC THIN LINE
Document Type and Number:
Japanese Patent JP2003136126
Kind Code:
A
Abstract:

To provide a method and apparatus for wiredrawing a metallic thin line capable of reducing a winding tension while optimizing drawing conditions in the final die and further capable of lowering a surface flaw generated on the surface of the metallic thin line after wiredrawing in the wire drawing of the metallic thin line by a cone type slip model wire drawing machine.

The method for wiredrawing a metallic thin line by the cone type slip model wire drawing machine is characterized in that a pair of capstans 2 and the final die 4 are immersed into a lubricating liquid 9 and the metallic thin line 1 after passing through the final die 4 contacts the pair of capstans 2 to be wound by a winding bobbin. The slip rate between the metallic thin line 1 after passing through the final die 4 and the capstan 2 is so designed to be 5 to 80%. A liquid drop adherent protection cover 10 is provided to prevent the liquid drop 11 of the lubricating liquid that splashes, adhering to a pulley 5 on the way to the wire winding bobbin 7 from the capstan 2 from splashing to the wire winding bobbin 7.


Inventors:
KITA TATSUHIKO
UEDA TAKAYUKI
NISHIBAYASHI KAGEKIMI
Application Number:
JP2001327369A
Publication Date:
May 14, 2003
Filing Date:
October 25, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NITTETSU MICRO METAL KK
International Classes:
B21C1/00; B21C1/06; B21C9/00; (IPC1-7): B21C1/00; B21C1/06; B21C9/00
Attorney, Agent or Firm:
Shunta Naito (1 outside)