Title:
METHOD FOR ASSEMBLING DIFFERENTIAL PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP3134828
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the structure of a differential pressure sensor that is suited for obtaining an accurate pressure signal and can be manufactured easily and a method for assembling the sensor.
SOLUTION: A semiconductor chip 1 with a pressure-sensitive part, a fixing stand 2 where a thin part 11 is provided at an outer periphery and the outer- periphery part of the thin part 11 is formed in perpendicular direction, and a housing 4 where a guide part 28 for determining a position for fixing the fixing stand 2 is formed are joined. The semiconductor chip 1 and the fixing stand 2 are joined as an assembly body, and the assembly body is incorporated into the guide part 28 of the housing 4. The peripheral part of the fixing stand 2 and the above housing 4 are joined from a direction where the above assembly body is incorporated, thus facilitating a process for manufacturing a differential pressure sensor extremely and improving yield and quality.
Inventors:
Tomoyuki Tobita
Akira Sase
Yoshimi Yamamoto
Kenichi Aoki
Akira Sase
Yoshimi Yamamoto
Kenichi Aoki
Application Number:
JP30525297A
Publication Date:
February 13, 2001
Filing Date:
November 07, 1997
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G01L13/00; G01L9/00; (IPC1-7): G01L13/00
Domestic Patent References:
| JP59210338A | ||||
| JP3194432A | ||||
| JP57112228U |
Attorney, Agent or Firm:
Yasuo Sakuta