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Patent Searching and Data


Title:
METHOD FOR ASSEMBLING LOAD SENSOR
Document Type and Number:
Japanese Patent JPS63168524
Kind Code:
A
Abstract:
PURPOSE:To uniformize a resistance characteristic, at the time of the assembling of a load sensor consisting of a power plate to be distorted by external force and pressure-sensitive conductive rubber converting the distortion quantity of said plate to resistance change, by pressing the conductive rubber while monitoring the resistance thereof to fix the same at a predetermined position. CONSTITUTION:An electrode 1 for pressure-sensitive conductive rubber, the wiring 2 of a circuit for detecting pressing force and an adhesive metal surface 3 for soldering a spacer part to an epoxy resin substrate 5 are formed to the surface of the substrate 5 by photoengraving, and a spacer 7 composed of a stainless steel plate coated with a predetermined amount of a solder cream 6 on both front and back surface thereof, pressure-sensitive conductive rubber 8 and a rotary element 9 for detecting resistance are provided on the metal surface surface 3. A printed wiring board 10 is provided on the spacer 7 and the conductive rubber 8 to form a combination body 11' and a heating apparatus 12 composed of a halogen lamp is mounted so as to correspond to the spacer 7 to perform temporary fixing at first under heating. Thereafter, the solder part is plastically deformed by pressing and final fixing is performed when the resistance measured by a resistance measuring apparatus 14 reaches a predetermined value.

Inventors:
HATTORI YASUSHI
Application Number:
JP31172886A
Publication Date:
July 12, 1988
Filing Date:
December 30, 1986
Export Citation:
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Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
G01L1/20; (IPC1-7): G01L1/20
Attorney, Agent or Firm:
Shinichi Ogawa