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Title:
METHOD OF ASSEMBLING THERMOELECTRIC TRANSDUCING MODULE AND BLAZING MATERIAL USED FOR ASSEMBLING THE MODULE
Document Type and Number:
Japanese Patent JP2004342879
Kind Code:
A
Abstract:

To provide a method of assembling a thermoelectric transducing module by which the deterioration of a thermoelectric transducing material can be suppressed, and the thermoelectric transducing module assembled by the same; and also to provide a blazing material to be used in a bonding process in the assembling method.

In the assembling method of the thermoelectric transducing module 10 in which a plurality of thermoelectric transducing materials are electrically connected in series via electrode members 12, has a process of bonding the electrode members 12 and thermoelectric transducing members 11 which include the thermoelectric transducing materials as constituent elements, using the blazing material, the electrode members 12 and the thermoelectric transducing members 11 are bonded together with a silver-based blazing material having a melting point of 600°C or below being interposed between the bonding surfaces of the electrode members 12 and the thermoelectric transducing members 11.


Inventors:
Hori, Yasuhiko
Kusano, Daisuke
Miyazaki, Kenichi
Shimada, Tomohiro
Kusamori, Hiroyuki
Kudo, Noriyuki
Application Number:
JP2003000138476
Publication Date:
December 02, 2004
Filing Date:
May 16, 2003
Export Citation:
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Assignee:
CENTRAL RES INST OF ELECTRIC POWER IND
TANAKA KIKINZOKU KOGYO KK
International Classes:
B23K35/26; B23K35/30; H01L35/08; H01L35/32; H01L35/34; H02N11/00; B23K35/26; B23K35/30; H01L35/00; H01L35/32; H02N11/00; (IPC1-7): H01L35/34; B23K35/26; B23K35/30; H01L35/08; H01L35/32; H02N11/00