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Patent Searching and Data


Title:
METHOD FOR ATTACHING DIE
Document Type and Number:
Japanese Patent JP2013046941
Kind Code:
A
Abstract:

To perform attachment of a punch and a die efficiently and with high accuracy.

A method for attaching a die includes: preparation of a replaceable unit in which a die and a punch are incorporated with accuracy during punching of a material; placement of the replaceable unit on a placement surface so that a lower surface of the die of the replaceable unit comes into contact with the placement surface in a punching device; fixing the die on the placement surface; moving an upper die so that the lower surface of the upper die for moving the punch in the moving direction comes into contact with the upper surface of the punch; and fixing the upper die and the punch.


Inventors:
NOGAMI TETSUYA
SUZUKI HIDEYUKI
Application Number:
JP2011185909A
Publication Date:
March 07, 2013
Filing Date:
August 29, 2011
Export Citation:
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Assignee:
NOGAMI GIKEN KK
International Classes:
B26F1/00; B21D37/04
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation