PURPOSE: To provide a method for bonding adherends together by using a two- pack epoxy adhesive, which method gives a high bonding strength by cold curing with less dispersion comparable to that of heat curing.

CONSTITUTION: A method for bonding at least two adherends comprising putting a two-pack adhesive, that is an epoxy adhesive, composed of a chief agent and a curing agent between the joint surfaces of the adherends arranged with the surfaces facing each other, which method further comprises applying only the chief agent of the epoxy adhesive to the joint surface of at least one adherend and heating the resultant surface, then putting the epoxy adhesive formed by mixing the chief agent and the curing agent between the joint surface of the adherend to which only the chief agent has been applied and the joint surface of another adherend, and curing the chief agent and the mixed chief agent and curing agent at room temperature thereby to bond the adherends together.