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Title:
METHOD OF BONDING ALUMINUM MEMBER TO METALLIC MEMBER AND BONDING METHOD
Document Type and Number:
Japanese Patent JP2014231091
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding method capable of improving a bonding strength of bonding an aluminum member to a metallic member.SOLUTION: In S102, while an aluminum wire is urged so as to pressure-contact the aluminum wire with a copper wire by a spring, a current is applied so that temperatures of an end portion of the aluminum wire in contact with the copper wire and an end portion of the copper wire in contact with the aluminum wire are equal to or higher than an eutectic point temperature and lower than a melting temperature. After passage of certain time since the end portion of the aluminum wire starts softening, the aluminum wire and the copper wire are pressure-contacted by a compressed air pressurizing portion and the spring while applying a current to the aluminum wire and the copper wire in S103, a displaceable length between one end portion supporting one end of the spring and the other end portion of the compressed air pressurizing portion being longer than that of the spring. As a result, oxide films and molten parts formed on the end portions of the aluminum wire and those of the copper wire are removed, and a uniform and thin diffused layer is formed between the end portion of the aluminum wire and that of the copper wire. Therefore, strength of a portion in which the aluminum wire is bonded to the copper wire can be intensified.

Inventors:
ITO YOSHIFUMI
INOMATA NORIYASU
KAYUKAWA KIMIJI
SHIRAI HIDEAKI
Application Number:
JP2013114222A
Publication Date:
December 11, 2014
Filing Date:
May 30, 2013
Export Citation:
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Assignee:
DENSO CORP
International Classes:
B23K20/00
Domestic Patent References:
JP2012006068A2012-01-12
JPS50134944A1975-10-25
JP2001030081A2001-02-06
JP2007175740A2007-07-12
Foreign References:
US20140299582A12014-10-09
US20140299582A12014-10-09
Attorney, Agent or Firm:
Masaki Hattori