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Patent Searching and Data


Title:
METHOD FOR BONDING IN FITTING STRUCTURE
Document Type and Number:
Japanese Patent JPH0352979
Kind Code:
A
Abstract:

PURPOSE: To enhance coaxial properties and whirling accuracy and provide firm bonding by applying and forming a specific adhesive layer on a cylindrical fitting member, then fitting and inserting a member to be fitted into the middle, simultaneously rotating the aforementioned member and further fitting and inserting the member to the last.

CONSTITUTION: An adhesive layer prepared by dispersing microspheres in anaerobic adhesive is initially applied and formed on the top inner peripheral surface of a cylindrical fitting member (A). On the other hand, a member (B) to be fitted is inserted and sucked into a suction metal fixture (2a) above a coaxial line thereof and then decompressed with a vacuum pump to such the aforementioned member (B) to be fitted. In this state, a supporting block 12 is subsequently lowered by action of an air cylinder 11 to insert a fitting part (B') of the aforementioned member (B) to be fitted into the above-mentioned cylindrical fitting member (A) to the middle and a supporting shaft (2b) is simultaneously rotated. The insertion of the aforementioned member (B) to be fitted is then completed by action of an air cylinder 9. Thereby, flow of the adhesive is promoted to carry out sufficient bonding.


Inventors:
HONDA MITSURU
KOBAYASHI ATSUKO
Application Number:
JP18606689A
Publication Date:
March 07, 1991
Filing Date:
July 20, 1989
Export Citation:
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Assignee:
CANON KK
International Classes:
C09J5/00; B29C65/00; B29C65/06; B29C65/52; B29C65/78; C09J5/06; (IPC1-7): C09J5/00
Attorney, Agent or Firm:
Yamashita