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Title:
METHOD OF BONDING METAL COPPER ON SUBSTRATE
Document Type and Number:
Japanese Patent JPS6066896
Kind Code:
A
Abstract:
Metallic copper is deposited on a substrate by confining the vapour of a fluorinated organic copper compound in an enclosed chamber containing the substrate, and decomposing the copper compound by subecting it to light.

Inventors:
TOOMASU HOORU BAUMU
FURANSESU AN HOURU
KIYARORU RUUSU JIYOONZU
Application Number:
JP11674784A
Publication Date:
April 17, 1985
Filing Date:
June 08, 1984
Export Citation:
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Assignee:
IBM
International Classes:
H05K3/14; C23C16/18; H01L21/28; H01L21/285; (IPC1-7): H01L21/285; H05K3/14
Domestic Patent References:
JPS5036999A1975-04-07
JPS5767161A1982-04-23
Attorney, Agent or Firm:
Tsukio Okada



 
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