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Title:
METHOD FOR BONDING PIEZOELECTRIC ELEMENT
Document Type and Number:
Japanese Patent JPH0542674
Kind Code:
A
Abstract:

PURPOSE: To enhance a peel resistance to vibration and to transmit the displacement of a piezoelectric element to a vibration plate more efficiently.

CONSTITUTION: In a method wherein a piezoelectric element 7 is bonded on the surface of a conductive vibration plate or an insulating vibration plate 6 provided with an electrode surface layer 9, a film of a coupling agent 11 is formed on the surface of the vibration plate 6 as a first process, the piezoelectric element 7 is bonded on the film with an insulating adhesive 10 as a second process, and the process is completed after the adhesive is cured.


Inventors:
SASAKI KOSUKE
MATSUMOTO HIROZO
Application Number:
JP19967591A
Publication Date:
February 23, 1993
Filing Date:
August 09, 1991
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
B41J2/16; (IPC1-7): B41J2/16
Attorney, Agent or Firm:
Iwao Yamaguchi



 
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