PURPOSE: To enhance the durability against ink and a heat cycle by a single bonding method without applying thermal damage by bonding a thin plate having an Sn diffusion preventing layer by solder in the bonding of a printing head for an ink jet printer.
CONSTITUTION: An Ni plating layer 3 with a thickness of 1μm, a Pd plating layer with a thickness of 0.2μm being an Sn diffusion preventing layer 4 and a Pb-50wt.% Sn plating layer with a thickness of 5μm being a solder layer 5 are applied to a diaphragm 6 and a restrictor 7. Next, three thin plates are aligned to be set between heating and pressing jigs 10, 10 and heated to 300°C in a vacuum within a bonding chamber while pressed under pressure of 5kgf/cm2 by a press device and, after cooling, the bonding chamber is opened to the atmosphere to take out a bonded object. By bonding the thin plates under heating and pressure in a vacuum or inert gas by solder, a bonded part excellent in the durability against ink and a heat cycle can be obtained without applying a thermal damage to the thin plates.
TAMAHASHI KUNIHIRO
KONO AKIOMI
HORINO MASAYA
