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Title:
バナジウム系膜を金属結合部に接合し、シールする方法
Document Type and Number:
Japanese Patent JP7239499
Kind Code:
B2
Abstract:
A method of joining and sealing a vanadium based membrane to a metallic connection section comprising: mounting a section of a vanadium based membrane on a connector formation of a connection section, the connection section being formed of a different metal to the vanadium based membrane, the connector formation providing a recess into which a section of the vanadium based membrane is seated and a connection interface in which the end face of the vanadium based membrane is proximate to or substantially abuts an adjoining face of the connector formation; mounting and operating a chiller arrangement in thermal contact with vanadium based membrane proximate the connection interface; heating a filler metal on the connection section to at least the liquidus temperature of the filler metal using a laser beam directed onto the filler metal located on the connection section and having a beam edge positioned at an offset location spaced apart from the connection interface a distance that attenuates direct heating of the vanadium based membrane by the laser beam, and on the connection section, such that the filler metal can flow over the connection interface from the offset location onto the vanadium based membrane; and cooling the filler metal to form a bridging section of filler metal between the vanadium based membrane and connection section over the connection interface.

Inventors:
David Michael Viano
Michael David Dolan
Application Number:
JP2019572185A
Publication Date:
March 14, 2023
Filing Date:
June 25, 2018
Export Citation:
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Assignee:
Commonwealth Scientific and Industrial Research Organization
International Classes:
B01D71/02; B01D69/00; B01D69/04; B23K1/005; B23K1/19
Domestic Patent References:
JP2005199117A
JP2003334418A
JP2005296746A
JP2013248651A
JP11250806A
JP2006032192A
JP2005200273A
Foreign References:
US20150368762
US6152987
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe