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Title:
METHOD FOR BONDING SURFACE PLATE TO SUBSTRATE HAVING CURVED SURFACE
Document Type and Number:
Japanese Patent JPS57198772
Kind Code:
A
Abstract:

PURPOSE: To bond a surface plate to a substrate having curved surface preventing the lifting and wrinkling of the surface plate at the curved part, by pressing and bonding the surface plate first to the curved part of the substrate and then to the non-curved part thereof.

CONSTITUTION: For example, the surface plate 4 such as a decorative sheet is bonded to a substrate having curved surface, by moving the roller press 7 to the direction of the arrow 8 to press and bond the surface plate 4 to the curved part 5 of the substrate, and then moving the roller press 7 along the arrow 9 while pressing the surface plate 4 to effect the pressing and bonding of the surface plate 4 to the non-curved part 6 of the substrate 3.

USE: Substrate for the top of a dresser, etc.


Inventors:
HAYASHI KEIICHI
Application Number:
JP8270381A
Publication Date:
December 06, 1982
Filing Date:
May 31, 1981
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C09J5/00; (IPC1-7): C09J5/00
Domestic Patent References:
JP48062345B