Title:
METHOD FOR BONDING TITANIUM MATERIAL OR TITANIUM ALLOY MATERIAL
Document Type and Number:
Japanese Patent JP2002292474
Kind Code:
A
Abstract:
To provide a method for bonding a titanium material or a titanium alloy material capable of performing a high quality liquid-phase diffusion bonding having less bonding defects.
Ni and Cu are plated on either one of bonding surfaces 1a, 2a of the two materials to be bonded 1, 2 composed of titanium or titanium alloy and in the state that the bonding surface sides of the two materials to be bonded are joined, the insert material 3 is formed so as to have three layers construction, namely, Ni layer-Cu layer-Ni layer. Then, the two materials to be bonded are bonded by liquid-phase diffusion via the insert material.
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Inventors:
YAJIMA SHINICHI
SHIMANUKI MASAKAZU
ANDO NORIO
SHIMANUKI MASAKAZU
ANDO NORIO
Application Number:
JP2001100489A
Publication Date:
October 08, 2002
Filing Date:
March 30, 2001
Export Citation:
Assignee:
FUJI HEAVY IND LTD
International Classes:
B23K20/00; B23K20/16; B23K103/14; (IPC1-7): B23K20/00; B23K20/16
Domestic Patent References:
| JPS6028592B2 | 1985-07-05 |
Attorney, Agent or Firm:
Hiroshi Arafune (1 person outside)
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