Title:
METHOD OF BONDING TOP COVER OF BALL
Document Type and Number:
Japanese Patent JP2003126304
Kind Code:
A
Abstract:
To develop and provide a method of bonding a top cover of a ball which does not use a solvent, i.e., bonds the top cover by solventless means, is environmentally friendly, is odorless, eliminates the worry about a fire by the solvent, can save the time for drying of the solvent, can save places as well and does not require skill.
The ball is provided with an adhesive layer 2 on a carcass 1 and is placed with a top cover 3 on this adhesive layer 2 or the rear surface of the top cover 3 is provided with the adhesive layer 2 and the top cover 3 is placed on the carcass 1 and is bonded by using the solventless means.
More Like This:
WO/2008/044088 | BALL FOR SPORTS |
WO/2004/094005 | GAME BALL INCORPORATING A POLYMER FOAM |
Inventors:
SHIOZU ZENJIRO
Application Number:
JP2001329827A
Publication Date:
May 07, 2003
Filing Date:
October 26, 2001
Export Citation:
Assignee:
MIKASA X RAY
SHIOZU ZENJIRO
SHIOZU ZENJIRO
International Classes:
A63B41/08; A63B41/00; (IPC1-7): A63B41/08; A63B41/00
Attorney, Agent or Firm:
Yasuo Mihara
Previous Patent: METHOD OF REINFORCING SEWN SEGMENT OF SEWN BALL
Next Patent: SHAPE OF GOLF CLUB HEAD
Next Patent: SHAPE OF GOLF CLUB HEAD