Title:
METHOD FOR BORING PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2011025399
Kind Code:
A
Abstract:
To provide a method for boring a printed circuit board improving boring efficiency with high reliability in a plating layer formed in conductive plating.
A bottomed hole 5 is bored in the printed board 1 by laser, a plurality of sheets of the printed boards 1 bored with the bottomed holes 5 are overlapped, and the plurality of overlapped printed boards 1 are made into a workpiece W. A through-hole 4 is bored in the workpiece W by using a drill 6 having a larger diameter than that of the bottomed hole 5. In this case, a through-hole 5a may be bored by laser in place of the bottomed hole 5 bored in the printed board 1.
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Inventors:
ITO YASUSHI
MICHIGAMI NORIO
KAWASAKI YUTAKA
MICHIGAMI NORIO
KAWASAKI YUTAKA
Application Number:
JP2010100411A
Publication Date:
February 10, 2011
Filing Date:
April 23, 2010
Export Citation:
Assignee:
HITACHI VIA MECHANICS LTD
International Classes:
B26F1/16; B23K26/382; B23K26/40; H05K3/00
Domestic Patent References:
| JPH01171709A | 1989-07-06 | |||
| JPS57186389A | 1982-11-16 | |||
| JPS61136705A | 1986-06-24 | |||
| JPS5371268A | 1978-06-24 | |||
| JP2002335063A | 2002-11-22 | |||
| JPH0871995A | 1996-03-19 | |||
| JPH01171709A | 1989-07-06 | |||
| JPS57186389A | 1982-11-16 | |||
| JPS61136705A | 1986-06-24 | |||
| JPS63306847A | 1988-12-14 |