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Title:
METHOD FOR BREAKING AND CUTTING WITH LASER BEAM, METHOD FOR MANUFACTURING LENS OR LENS MOLD USING THE METHOD FOR BREAKING AND CUTTING AND LENS AND LENS MOLD FORMED WITH THE METHOD FOR MANUFACTURING
Document Type and Number:
Japanese Patent JP3886756
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method for breaking and cutting with a laser beam, which is characterized by the fact that a thermal distribution is formed on the surface of a hard and brittle material and the hard and brittle material is stripped off due to the thermal distribution.
SOLUTION: The method is characterized by the fact that a laser beam absorption material is applied on the surface of the hard and brittle material, the irradiated laser beam is absorbed by the laser beam absorption material, the thermal distribution is formed on the surface of the hard and brittle material and the hard and brittle material is stripped off due to the thermal distribution.


Inventors:
Junichi Ikeno
Horiuchi
Hirofumi Suzuki
Nakano Yasunori
Tsuyoshi Funayama
Application Number:
JP2001277400A
Publication Date:
February 28, 2007
Filing Date:
September 13, 2001
Export Citation:
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Assignee:
Japan Science and Technology Agency
International Classes:
B23K26/18; G02B3/00; B23K26/00; B23K26/38; B23K26/40; B28D5/00; C03B33/04; C03B33/09; C04B41/91; (IPC1-7): B23K26/18; B23K26/00; B28D5/00; C03B33/09; C04B41/91; G02B3/00
Domestic Patent References:
JP11216579A
JP11216580A
JP11217237A
Other References:
中村知史ら4名,レーザマイクロ割断に関する研究~3次元割断によるマイクロレンズ製造の可能性について~,2001年度精密工学会秋季大会 学術講演会講演論文集,日本,社団法人 精密工学会,2001年 9月10日,第613ページ
Attorney, Agent or Firm:
Nagase Seijo