Title:
METHOD OF BUNDLING WIRES
Document Type and Number:
Japanese Patent JPH10248143
Kind Code:
A
Abstract:
To bundle wires surely, regardless of the number thereof, and bundle over again easily, if necessary.
A plurality of wires 20 are drawn in a curled code 100 which is processed to keep a spiral shape to bundle these wires 20. When new wires 21 is to be bundled additionally to the wires 20 put in the curled code 100, the added wires 21 are wound together with the wires 20 along the spiral direction of the curled code 100 so that the wires 21 are taken in and added to the space of the curled code 100.
Inventors:
TANAKA AKIO
Application Number:
JP4552297A
Publication Date:
September 14, 1998
Filing Date:
February 28, 1997
Export Citation:
Assignee:
NIPPON DENKI HOME ELECTRONICS
International Classes:
B65D63/00; F16L3/12; H02G3/04; H02G3/30; (IPC1-7): H02G3/26; B65D63/00; F16L3/12; H02G3/04