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Title:
METHOD FOR CALIBRATING THERMAL TREATING DEVICE AND FOR FORMING AND CALIBRATING MATHEMATICAL MODEL THEREOF
Document Type and Number:
Japanese Patent JP2002130961
Kind Code:
A
Abstract:

To calibrate and form a mathematical model to estimate the temperature of a substance to be treated.

A method for forming a temperature estimated mathematical model for the thermal treating device formed that the output of a temperature sensor situated in a heating furnace is applied for a temperature estimated mathematical model to estimate the temperature of a wafer, and the heating furnace is controlled according to an estimated temperature. N-sets of temperature sensors are situated in positions of R1...Rn where a distance from a wafer center satisfies a formula 1. The wafers are contained in the heating furnace and by obtaining the outputs of the sensor of the heating furnace and the output of the sensor of a wafer, a temperature estimated mathematical model is produced. Through similar processing, a relation between an actual measurement and an estimated value is determined to calibrate the temperature estimated mathematical model. Formula 1 is K1.πR12=...=Kn+1.π(R2-Rn2), where K1-Kn+1 is a yield of an element with which a distance from a wafer center is obtained from n+1 regions intercepted by a circle of R1-Rn.


Inventors:
O BUNRYO
SUZUKI FUJIO
SAKAMOTO KOICHI
YASUHARA MOYURU
Application Number:
JP2000329717A
Publication Date:
May 09, 2002
Filing Date:
October 27, 2000
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
F27D19/00; F27D21/00; H01L21/31; (IPC1-7): F27D19/00; F27D21/00
Attorney, Agent or Firm:
Kimura Mitsuru