Title:
METHOD FOR CASTING INGOT FOR BONDING WIRE AND BONDING WIRE PRODUCED BY USING THE METHOD
Document Type and Number:
Japanese Patent JP2005138113
Kind Code:
A
Abstract:
To suppress the occurrence of such defective leaning that a bonding wire (1) leans at an immediate above portion (3) of a ball (2) adhered to a pad of a semiconductor element (4), then, the loop top part (1a) of the bonding wire (1) comes close to the loop top part (1b) of an adjacent bonding wire.
A method for casting an ingot for a bonding wire by slowly cooling a crucible from the lower part thereof or by a continuous casting method is disclosed, wherein molten metal is solidified by setting a relative shifting speed at the interface between the molten metal and the solidified portion to ≥20 mm/min. The boundary wire in which additive is uniformly dispersed in the main component metal can be produced by using the method.
Inventors:
FUKAZAWA MIKIO
Application Number:
JP2003374052A
Publication Date:
June 02, 2005
Filing Date:
November 04, 2003
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B22D11/00; B22D7/00; B22D11/055; B22D11/20; B22D11/22; C22C5/02; H01L21/60; (IPC1-7): B22D11/00; B22D7/00; B22D11/055; B22D11/20; B22D11/22; C22C5/02; H01L21/60
Attorney, Agent or Firm:
Asao Kamoda
Kameda Tetsuaki
Kameda Tetsuaki