STRIPPER/CLEANER, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING METAL WIRING USING STRIPPER/CLEANER

Title:

STRIPPER/CLEANER, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING METAL WIRING USING STRIPPER/CLEANER

Document Type and Number:

Japanese Patent JP2005209953

Kind Code:

A

Abstract:

To provide a stripper/cleaner with which slightly removable deposit on an wiring upper surface is removed well without excessively etching a metal layer forming the side wall and the wiring upper surface of a metal wiring pattern.

The stripper/cleaner contains at least a fluorine compound, a water-soluble organic solvent, water and a bidentate of 0.1-20 mass % to the whole quantity. In addition, the removal washing liquid contains at least a basic water solution, one or more kinds chosen from organic compounds having a carboxyl group and its anhydrate, water, and a bidentate of 0.5-10 mass % to the whole quantity.

Inventors:

HARAGUCHI TAKAYUKI
YOKOI SHIGERU
WAKIYA KAZUMASA

Application Number:

JP2004016139A

Publication Date:

August 04, 2005

Filing Date:

January 23, 2004

Export Citation:

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Assignee:

TOKYO OHKA KOGYO CO LTD

International Classes:

H01L21/3213; C11D7/10; C11D7/26; C11D7/50; C11D11/00; C23G1/12; C23G1/22; G03F7/42; H01L21/304; (IPC1-7): H01L21/304; H01L21/3213

Attorney, Agent or Firm:

Hiroaki Sakai

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