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Title:
METHOD FOR COATING METAL AND SYSTEM THEREFOR
Document Type and Number:
Japanese Patent JP2007138294
Kind Code:
A
Abstract:

To provide methods for coating metal substrates (12), systems therefor, and articles made thereby.

In one embodiment, the method of coating a metal substrate (12) comprises: disposing a metallic bond coating (14) on the metal substrate(12), creating ions with a reverse polarity high frequency apparatus at a frequency of greater than or equal to about 2.5 kHz, roughening the surface (18) with the ions to a subsequent average surface roughness of greater than or equal to about 5 μm, and disposing a ceramic coating (16) on the metallic bond coating surface (18). The metallic bond coating (14) has a surface with an initial average surface roughness of less than or equal to about 1 μm.


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Inventors:
NOWAK DANIEL ANTHONY
DIMASCIO PAUL STEPHEN
BUCCI DAVID VINCENT
Application Number:
JP2006308644A
Publication Date:
June 07, 2007
Filing Date:
November 15, 2006
Export Citation:
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Assignee:
GEN ELECTRIC
International Classes:
C23C28/00; C23C4/08
Domestic Patent References:
JPH05195188A1993-08-03
JPH08319553A1996-12-03
JPH09316622A1997-12-09
JP2002348681A2002-12-04
JP2005199419A2005-07-28
JPS5755559U1982-04-01
Attorney, Agent or Firm:
Kenichi Matsumoto
Hirokazu Ogura
Toshihisa Kurokawa
Arakawa Satoshi



 
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