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Title:
METHOD FOR COMPENSATING HEAT GENERATION OF SEMICONDUCTOR ELEMENT TEST HANDLER
Document Type and Number:
Japanese Patent JP2004061488
Kind Code:
A
Abstract:

To provide a method for compensating the heat generation of a semiconductor element test handler in which the test can be performed at an accurate temperature, by compensating the temperature deviation due to the heat generation of the semiconductor element itself, in the temperature test of the semiconductor element.

A step for starting the test by mounting the semiconductor element into a socket, a step for feedbacking the measured value of the temperature sensor real-time, for detecting the variation amount thereof, and for comparing it with a set value, a step for ejecting a cooling fluid to the semiconductor element by controlling a cooling fluid supply means, when the variation amount of the measured value is equal to or more than the set value, as a result of the comparison, and a step for suspending the ejection of the cooling fluid to the semiconductor element by controlling the cooling fluid supply means, when the variation amount of the measured value is less than the set value, as a result of the comparison, are included. Accordingly, the test yield can be improved by optimizing the test environment.


Inventors:
SONG JAE MYEONG
HAM CHUL HO
PARK CHAN HO
LEE BYENG GI
Application Number:
JP2003055938A
Publication Date:
February 26, 2004
Filing Date:
March 03, 2003
Export Citation:
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Assignee:
MIRE KK
International Classes:
G01R31/26; G01K15/00; G01R31/28; H01L21/66; G01R1/44; (IPC1-7): G01R31/26
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Takahashi