Title:
METHOD FOR CONNECTING ELECTRIC WIRING BOARD TO SHIELD CASE
Document Type and Number:
Japanese Patent JP3255195
Kind Code:
B2
Abstract:
PURPOSE: To fit a shield case to an electric wiring board in a state where the wiring board is returned to a put state in an original board so as to make reflow soldering possible by applying a resist to the internal surface of a through hole across a substrate punching line except the substrate-side internal surface of the through hole and joining the shield case to the through hole after reflow soldering.
CONSTITUTION: A resist is applied to the internal surface of a through hole 4 across a substrate punching line 3 except the internal surface of the hole 4 on the substrate 2 side. Therefore, solder 9 does not stick to the hole 4 in one body even when reflow soldering is performed and can be easily removed from the hole 4. Therefore, a shield case 5 can be fitted to the hole 4 by reflow soldering while the substrate 2 is returned to a put state in an original board and the case 5 can be soldered to the substrate 2 while the substrate 2 is returned to a put state in the original board after reflow soldering. Therefore, excellent effects can be obtained in such a way that the workability and productivity can be remarkably improved and the unit prices of parts can be reduced, and so on.
Inventors:
Hirotoshi Takahashi
Toru Sudo
Kanemi Sasaki
Toru Sudo
Kanemi Sasaki
Application Number:
JP10883893A
Publication Date:
February 12, 2002
Filing Date:
April 12, 1993
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
Kokusai Electric Engineering Co., Ltd.
Kokusai Electric Engineering Co., Ltd.
International Classes:
H05K7/14; H05K1/02; H05K3/34; H05K9/00; H05K3/00; (IPC1-7): H05K9/00; H05K1/02; H05K3/34; H05K7/14
Domestic Patent References:
| JP56147500A | ||||
| JP2268493A | ||||
| JP3248598A | ||||
| JP2285695A | ||||
| JP592176U |
Attorney, Agent or Firm:
Shoji Miyoshi