Title:
METHOD FOR CONNECTING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3256331
Kind Code:
B2
Abstract:
PURPOSE: To fix conductive particles to an electrode of an electronic component by transferring the particles on a transfer plate to the electrode of the component which an adhesive layer is previously formed, and then curing the layer while pressurizing.
CONSTITUTION: After predetermined number of conductive particles previously arranged at a predetermined position on a transfer plate are transferred only by the predetermined number to a predetermined position on an electrode 9 of a circuit board 10 previously formed with an adhesive layer 7, the layer 7 is cured to fix the particles to the electrode 9 of the board 10. Thereafter, another circuit board is fixed to the board 10 in which the particles 4 are fixed to the electrode 9 with adhesive. Thus, it can be so disposed that the particles are not moved between adjacent electrodes 9 to cope with a fine pitch without operating or short-circuiting between the adjacent electrodes 9.
Inventors:
Yoshihiro Yoshida
Application Number:
JP14315393A
Publication Date:
February 12, 2002
Filing Date:
June 15, 1993
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01L21/60; H05K3/32; H05K3/36; (IPC1-7): H05K3/32; H01L21/60; H05K3/36
Domestic Patent References:
| JP574846A | ||||
| JP3289070A | ||||
| JP62165943A |
Attorney, Agent or Firm:
Gunichiro Ariga
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