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Patent Searching and Data


Title:
METHOD OF CONNECTING FILAMENT AND CONDUCTOR
Document Type and Number:
Japanese Patent JP54120981
Kind Code:
A
Abstract:

PURPOSE: To improve the efficiency of connecting work, and also to better the yield of products, by connecting a filament and conductors by stacking the filament and the conductors in a channel of a drag and by crushing the filament and the conductors by a lower surface of a cope when connecting the subminiature filament to the conductors.

CONSTITUTION: A subminiature filament 3 with approximate 1mm length is entered into a holding channel 2 formed to a surface of a drag 1. Since the filament 3 is held in the channel, its location is not changed by wind and vibration. The end portions of conductors 4, 4 are inserted into both end portions of the holding channel 2, and stacked to the filament 3. Lastly, a cope 6 is let fall, the filament 3 and the conductors 4 are crushed, and the leg portions 5, 5 of the filament 3 are buried into the conductors 4, 4, thus connecting the filament and the conductors. Since the filament and the conductors are held in the holding channel, both contact portions do not slip by vibration and wind, thus also improving the yield of products. Even when the filament 3 and the conductors 4 cross at right angles, both holding channels may be utilized.


Inventors:
Yoshiike, Ryoji
Kosuge, Masaru
Application Number:
JP1978000028068
Publication Date:
September 19, 1979
Filing Date:
March 11, 1978
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01K3/06; H01K3/00; (IPC1-7): H01K3/06