PURPOSE: To prevent the bonding electrode section of a semiconductor chip from being damaged by connecting a lead wire with the bonding electrode by plating while the lead wire is brought into contact with the bonding electrode.

CONSTITUTION: A tape cap 1 provided with a lead wire 2 is placed on a positioning jig 8 and the leading end of the wire 2 is brought into contact with the electrode 7 of a semiconductor chip. Then the semiconductor chip is dipped in a plating bath 10, with the wire 2 being brought into contact with the electrode 7. When a (+) electrode is connected to the lead wire and a (-) electrode is connected to the plating metal, such as copper, etc., and an electric current is made to flow between the electrodes, the plating metal is plated at and around the connecting section of the wire 2 and electrode 7 and the wire 2 and electrode 7 are firmly connected to each other through a plated layer 12. Therefore, the damage of the bonding electrode 7 can be prevented.