Title:
METHOD OF CONNECTING METALS AND METHOD OF MOUNTING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2004342877
Kind Code:
A
Abstract:
To provide a method of connecting metals which requires no heating nor pressurization, and to provide a method of mounting electronic components.
The method of connecting metals comprises a step of preparing bumps 1 and 2 which are formed of Cu or Cu alloy, disposing a conductive auxiliary film 3 between the bumps 1 and 2, and applying voltage between the bumps 1 and 2 to connect them. It is preferred that the conductive auxiliary film 3 is a film formed of a polymeric material, and that the voltage applied between the bumps 1 and 2 is 0.5-10 V.
Inventors:
Ueno, Takashi
Iijima, Asao
Endo, Kimiyoshi
Ohira, Hiroshi
Iijima, Asao
Endo, Kimiyoshi
Ohira, Hiroshi
Application Number:
JP2003000138457
Publication Date:
December 02, 2004
Filing Date:
May 16, 2003
Export Citation:
Assignee:
DEPT CORP
NORTH:KK
NORTH:KK
International Classes:
H05K3/32; H01L21/60; H05K3/32; H01L21/02; (IPC1-7): H01L21/60; H05K3/32