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Patent Searching and Data


Title:
METHOD FOR CONNECTING TRANSPARENT THERMOPLASTIC RESIN MEMBER BY LASER
Document Type and Number:
Japanese Patent JP2003181931
Kind Code:
A
Abstract:

To provide a method which can deal with a precise application and connect a transparent resin member in an extremely short time without impairing an appearance of a product by maintaining the member excellent transparency original in the member even after the connection.

The method for connecting the transparent thermoplastic resin member by laser comprises the steps of superposing a plurality of transparent resin members at contact surfaces in a state in which a very thin infrared absorption transparent film having an absorbability of a laser beam is interposed between adjacent transparent thermoplastic resin members each having non- absorbability of the laser beam, and fusion-bonding the resin members by irradiating the outside surfaces of the transparent resin members with the laser beam. When the superposed resin members are irradiated with the laser beam, the infrared absorbing transparent film interposed between the transparent resin members absorbs the radiation energy of the laser beam to generate a heat, thereby fusion-bonding the transparent resin members.


Inventors:
KUROSAKI YASUO
SATO KIMITOSHI
MUSHIAKI NAOHIKO
SUZAKI KATSUO
KUBO AKIO
Application Number:
JP2001389551A
Publication Date:
July 03, 2003
Filing Date:
December 21, 2001
Export Citation:
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Assignee:
KUROSAKI YASUO
SATO KIMITOSHI
SUMIKA COLOR KK
KANTUM ELECTRONICS CO LTD
International Classes:
B29C65/16; B29C65/40; C08G85/00; C09J5/06; C09J9/00; (IPC1-7): B29C65/16; B29C65/40; C08G85/00; C09J5/06; C09J9/00
Attorney, Agent or Firm:
Ichiro Sugawara