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Title:
METHOD FOR CONSTRUCTING CUT-OFF STRUCTURE, AND CUT-OFF STRUCTURE
Document Type and Number:
Japanese Patent JP2010209594
Kind Code:
A
Abstract:

To provide a method for constructing a cut-off structure which hardly deteriorates the property of following displacement caused by an aperture etc.

In the method constructing the cut-off structure 10 of an underground structure 1 constituted by continuously installing first and second building frames 2a and 2b, the method is characterized by including: a first building frame construction step of constructing the first building frame 2a; a seal attachment step of fixing a seal member 11 to a seal attachment surface formed on the first building frame 2a; a seal compressing step of compressing the seal member 11 between the seal attachment surface and the joint end surface plate 12 by arranging the joint end surface plate 12 in such a manner as to face the seal attachment surface, and keeping an isolation distance between the joint end surface plate 12 and the first building frame 2a constant so as to maintain the compressed state of the seal member 11; and a second building frame construction step of constructing the second building frame 2b next to the first building frame 2a, and fixing the joint end surface plate 12 to the second building frame 2b.


Inventors:
MORITA TAIJI
ADACHI HIDEAKI
SUNO KEIJI
SEKIYA MASAYUKI
Application Number:
JP2009057368A
Publication Date:
September 24, 2010
Filing Date:
March 11, 2009
Export Citation:
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Assignee:
TAISEI CORP
MITSUBISHI RUBBER
International Classes:
E02B3/16; E02D29/16; E02D31/02; E03F3/04; E21D11/38
Domestic Patent References:
JPS591791U1984-01-07
JP2004169327A2004-06-17
JP2004244813A2004-09-02
JP2008013995A2008-01-24
JP2007298111A2007-11-15
JP2005273750A2005-10-06
Attorney, Agent or Firm:
Isono Dozo
Etsuo Tada
Nosho Machida