To provide a method for controlling consumption amount of a cutting blade in a cutting device with the cutting blade capable of always continuing cutting.

This method is used in the cutting device including first and second chuck tables. The method includes a first cutting process for holding and cutting a wafer on the first chuck table, a second cutting process for holding and cutting a wafer on the second chuck table, a consumption amount calculating process for positioning the first chuck table just under a depth detection means by utilizing time while the second cutting process is executed, detecting a depth of a cut groove formed in the wafer by the depth detection means and calculating the consumption amount of the cutting blade from the detected groove depth, and a position correcting process for correcting an origin position of a height direction of the cutting blade based on the consumption amount of the cutting blade.