Title:
METHOD FOR CONTROLLING DEPOSITION AND RESPUTTERING OF MATERIAL ON SURFACE
Document Type and Number:
Japanese Patent JP2023067782
Kind Code:
A
Abstract:
To achieve a simple and cost-effective PVD system.SOLUTION: A method for depositing a deposition material by physical vapor deposition (PVD) into a plurality of recesses formed in a substrate, includes the steps of: arranging the substrate on a substrate supporting upper surface of a substrate support with an arrangement of permanent magnets being arranged below the substrate supporting upper surface so that permanent magnets are disposed below the substrate; and depositing a deposition material into the recesses formed in the substrate by sputtering a sputtering material from a target of a magnetron device. In the step of depositing the deposition material, the arrangement of permanent magnets provides a substantially uniform lateral magnetic field across the surface of the substrate which extends into a region beyond a periphery of the substrate to enhance resputtering of deposited material deposited into the recesses.SELECTED DRAWING: Figure 2
Inventors:
SCOTT HAYMORE
THOMAS ADRIAN
TONY WILBY
STEPHEN BURGESS
THOMAS ADRIAN
TONY WILBY
STEPHEN BURGESS
Application Number:
JP2022164698A
Publication Date:
May 16, 2023
Filing Date:
October 13, 2022
Export Citation:
Assignee:
SPTS TECHNOLOGIES LTD
International Classes:
C23C14/35
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office
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