Title:
MICROWAVE COUPLING LINE
Document Type and Number:
Japanese Patent JP3142010
Kind Code:
B2
Abstract:
PURPOSE: To miniaturize a coupling line in a semiconductor integrated circuit and to facilitate circuit integration by forming strip central conductors while being overlapped with each other.
CONSTITUTION: A ground conductor 1 is formed on the entire face of a substrate 6 made of a semiconductor and a dielectric film 4 is formed on the conductor 1 and a strip center conductor 2 is formed on a dielectric film 4. Furthermore, after a dielectric film 5 is formed on the dielectric film 4 and the center conductor 2, the strip center conductor 3 is formed on the dielectric film 5. Furthermore, the center conductor 2 is formed in a meandering shape while the center line is made equal each other. That is, the central conductors 2, 3 are formed overlappingly to form the microwave line respectively with respect to a ground conductor 1 to reduce the area occupied by the microwave coupling line and to miniaturize the size and to facilitate the circuit integration.
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Inventors:
Kazuhiko Toyoda
Tetsuo Hirota
Tsuneo Tokumitsu
Tetsuo Hirota
Tsuneo Tokumitsu
Application Number:
JP18761291A
Publication Date:
March 07, 2001
Filing Date:
July 26, 1991
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H01P3/08; H01P5/02; H01P5/18; (IPC1-7): H01P5/18
Domestic Patent References:
| JP63300606A | ||||
| JP2276301A | ||||
| JP63246005A | ||||
| JP6489802A | ||||
| JP426201A | ||||
| JP6017008U |
Other References:
【文献】米国特許4482873(US,A)
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)