Title:
METHOD FOR CORRECTING BREAKING OF WIRE
Document Type and Number:
Japanese Patent JPH02212811
Kind Code:
A
Abstract:
PURPOSE:To improve the operation efficiency and reliability by arranging pads for the wire breaking correction of a scanning line group and a signal line group at the start point and end point of the scanning line group and signal line group, and correcting the breaking of scanning lines and signal lines by wire bonding. CONSTITUTION:If a signal line A is broken, a bonding pad 2 for correction which is arranged at the start point of the signal line A and a bonding pad arranged on a correction line 3 are bonded by a wire to connect the wiring. Then a bonding pad 5 for correction which is arranged at the end point of the signal line A and the bonding pad arranged on the correction line 3 are bonded by a wire by an ultrasonic aluminum wedge bonder. Consequently, the breaking of a wire can easily be corrected even by a person other than a skilled operator and the reliability can be improved.
Inventors:
MIYASAKA HITOSHI
Application Number:
JP3412689A
Publication Date:
August 24, 1990
Filing Date:
February 14, 1989
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/13; G02F1/1345; G02F1/136; G02F1/1368; H01L21/82; G02F1/1362; (IPC1-7): G02F1/13; G02F1/1345; G02F1/136; H01L21/82
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)