To simply and automatically correct the positions of a substrate and a mask.
A reference substrate 62A and a reference mask 62B which have a plurality of measurement marks 61A and 61B respectively are set at specified positions, within the range of cream solder printing, of the cream solder printer. Further, the difference between the respective actual mark positions of the reference substrate 62A and the reference mask 62B and the respective mark positions of the substrate 62A and the reference mask 62B observed through a camera 10, is previously sought and the obtained results are registered as mechanical error data per mark position. In addition, during printing the actual substrate 5, the registered mechanical error data at the nearest position to the positions of position registering marks 21 and 22, are added to the positional data of the position registering marks 21 and 22 of the substrate 5 observed through the camera 10 and thus positional correction data are obtained. Finally the positional correction of the substrate 5 and the mask 7 are corrected using the positional correction data.
HONMA MAKOTO
YAHAGI MUTSUYUKI
