Title:
METHOD FOR CURING COATING MATERIAL OF JUNCTURE BETWEEN PRINTED CIRCUIT BOARD AND TAPE CARRIER PACKAGE AND LIQUID CRYSTAL DISPLAY DEVICE FORMED BY USING THE METHOD FOR CURING
Document Type and Number:
Japanese Patent JP3138859
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To stabilize the shape at the time of curing a coating material of the juncture between a tape carrier package and a printed circuit board.
SOLUTION: The height of a liquid crystal panel supporting part 30 for supporting a liquid crystal panel 25 is set lower than the height of a printed circuit board supporting part 31 and the position of the liquid crystal panel supplying part 30 is arranged on the side nearer the side where the printed circuit board 28 is not connected than the center of the liquid crystal panel 25. Even when a coating material 29 is applied in the open state of the spacing between the printed circuit board 28 and the tape carrier package 23, at least half the weight of the liquid crystal panel 25 is eventually applied at all times on the printed circuit board supporting part 31 at the time of curing the coating by housing the substrate in a tray 32 and the load thereof acts in the direction of bringing the tape carrier package 23 and the printed circuit board 28 into tight contact with each other and, therefore, the intrusion of the coating material into the spacing between the tape carrier package 23 and the printed circuit board 28 is minimized.
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Inventors:
Go Ishigame
Kenichiro Teramoto
Naohiro Fukuda
Kenichiro Teramoto
Naohiro Fukuda
Application Number:
JP30133696A
Publication Date:
February 26, 2001
Filing Date:
October 25, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
G02F1/1345; G09F9/00; H05K3/28; H05K3/36; (IPC1-7): G02F1/1345
Domestic Patent References:
| JP8248433A | ||||
| JP6216519A | ||||
| JP1212490A |
Attorney, Agent or Firm:
Shigetaka Awano