Title:
METHOD FOR CUTTING FUSE WIRING OF INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPH0910975
Kind Code:
A
Abstract:
PURPOSE: To provide a method capable of stably cutting fuse wirings without increasing the irradiation quantity of a laser beam.
CONSTITUTION: An integrated circuit chip 2 having the fuse wirings cuttable by the irradiation with the laser beam is arranged in a vacuum evacuatable vessel. The inside of this vacuum is so evacuated that a pressure lower than the atm. pressure is attained in the vessel. The fuse wirings are cut by irradiating the fuse wirings with the laser beam.
Inventors:
KANEKO AKIRA
Application Number:
JP15934195A
Publication Date:
January 14, 1997
Filing Date:
June 26, 1995
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B23K26/00; B23K26/14; B23K26/38; H01L21/302; H01L39/00; (IPC1-7): B23K26/00; B23K26/14; H01L21/302; H01L39/00
Attorney, Agent or Firm:
Keishiro Takahashi
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