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Patent Searching and Data


Title:
METHOD FOR CUTTING GLASS SUBSTRATE
Document Type and Number:
Japanese Patent JP2006143506
Kind Code:
A
Abstract:

To prevent the occurrence of cutting failures in a method for cutting a glass substrate for constituting a liquid crystal panel.

A seal layer 30 is formed on a first glass substrate 10 in such a manner that it includes a straight line part parallel to a line on which a scribe line SL is formed. Then, a dummy seal layer 30D is formed on the first glass substrate 10 in such a manner that it is in line symmetry with only the straight line part of the seal layer 30 with respect to the line on which the scribe line SL is formed. Further, a second glass substrate 20 is integrally stuck on the first glass substrate 10 through the seal layer 30 and the dummy seal layer 30D so as to form a laminated body 1. Thereafter, the laminated body 1 is cut and separated into each liquid crystal panel by subjecting each of the first and second substrates 10, 20 constituting the laminated body 1 to a scribing process and a breaking process. Lastly, liquid crystal is filled in the liquid crystal injection area 31 and sealed with a sealing material such as resin.


Inventors:
TAGUCHI EIJI
Application Number:
JP2004333833A
Publication Date:
June 08, 2006
Filing Date:
November 18, 2004
Export Citation:
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Assignee:
SANYO ELECTRIC CO
International Classes:
C03B33/07; B28D5/00; C03B33/09; G02F1/13; G02F1/1333; G02F1/1339; G09F9/00; G09F9/35
Attorney, Agent or Firm:
Katsuhiko Sudo