To provide a method for cutting joined glass, in which a joined glass piece formed by dividing the joined glass is easily taken out, manufacturing efficiency is improved and manufacturing cost is reduced, a method for manufacturing a package, the package, a piezoelectric vibrator, an oscillator, electronic equipment and a radio-controlled clock.
The method for cutting joined glass comprises: a scribing step of forming a scribe line M' on a substrate wafer for lid by irradiating along a contour line M, with laser beam of absorption wave length for a wafer joined body; a breaking step of cutting the wafer joined body along the scribe line M' by applying cleavage stress by a cutting blade along the scribe line M' to divide the wafer joined body into a plurality of piezoelectric vibrators; and an expanding step of expanding an interval between the piezoelectric vibrators adjacent to each other by drawing a UV tape 80. The UV tape 80 is formed to have thickness of 160-180 μm.
Noriaki Uchino
Nobuyuki Kimura