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Title:
METHOD FOR CUTTING PAPER WITH BUILT-IN IC CHIP
Document Type and Number:
Japanese Patent JP2011025378
Kind Code:
A
Abstract:

To provide a cutting method for arranging an IC chip at a prescribed position in a plate sheet after being cut in cutting of a continuous sheet of paper with the built-in IC chip.

When cutting the continuous sheet of the paper with built-in IC chip into the plate sheet, an inlet, a dummy mark or the like is detected with a transmission sensor attached to a cutter to identify a built-in IC chip part and cut the sheet of paper while controlling cutting timing so that the IC chip can be arranged at the prescribed position in the plate sheet. The transmission sensor is a semiconductor laser sensor having a light projection unit and a light reception unit, and it is desirable that a decrease rate of laser light transmission when an object to be detected passes between the light projection unit and the light reception unit is not less than 10%.


Inventors:
SHINOMIYA KOKI
TERAO TOMOYUKI
TOMITA KEITARO
USHIO MASAYUKI
Application Number:
JP2009175106A
Publication Date:
February 10, 2011
Filing Date:
July 28, 2009
Export Citation:
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Assignee:
OJI PAPER CO
OJI TOKUSHUSHI KK
International Classes:
B26D5/32; B26D5/34
Domestic Patent References:
JPH0940267A1997-02-10
JP3123670U2006-07-27
JP2007241561A2007-09-20
JP2000158391A2000-06-13
JPS61228610A1986-10-11



 
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