PURPOSE: To provide a pattern cutting method which can surely cut a wiring pattern.

CONSTITUTION: This pattern cutting method for multilayered printed wiring board is used for machining or cutting part of the wiring pattern 6 of a multilayered printed wiring board 2 by using a pattern cutting drill 14 having a diameter larger than the width of the pattern 6. After machining or cutting the part of the pattern 6 with the drill 14, a plurality of points P1-P6 are machined by using an extremely small conductive drill having a diameter sufficiently smaller than the width of the pattern 6 while the continuity between the drill and the pattern 6 to be cut is detected. The wiring pattern 6 is machined or cut by aligning the pattern cutting drill 14 to the center of gravity W of the graphic formed by at least three points P1, P2, and P5 after confirming the continuity at the three points P1, P2, and P5.