To provide a method for cutting a plurality of ingots without exerting adverse effect on the quality of a cut wafer even if a plurality of the ingots generating a gap between them are cut in such a state that a plurality of the ingots opposed to each other are arranged in an oblong state.

When a plurality of the ingots are fixed to the fixing means of a cutting device to be cut at the same time, a means for preventing the generation of difference in wire tension between the wire coming into contact with the ingots with respect to the gap between the ingots and the wire running through the gap is devised before a plurality of the ingots are cut at the same time.