Title:
METHOD FOR CUTTING PROCESS BY MEANS OF WIRE SAW
Document Type and Number:
Japanese Patent JP3770579
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for stably cutting and processing hard brittle material such as silicon, neodymium, ferrite and the like.
SOLUTION: This processing method is so designed that a wire saw, in which a large number of super abrasive grains are applied in an irregular form over to the circumferential surface of a wire of high strength, is brought into contact with the surface to be cut of hard brittle material so as to be passed over at high speed higher than 800 m/minute with respect to the hard brittle material. The wire saw to be used is formed out of resin bond containing a strong bond, and it is desirable that each abrasive grain space is made in such a way as to be greater than 4.0 mm3/m, which is formed by each abrasive grain projected out of a bond layer.
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Inventors:
Masaaki Yamanaka
Hideki Ogawa
Nobuo Urakawa
Hideki Ogawa
Nobuo Urakawa
Application Number:
JP13461898A
Publication Date:
April 26, 2006
Filing Date:
April 28, 1998
Export Citation:
Assignee:
Allied Material Co., Ltd.
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Domestic Patent References:
| JP9150314A | ||||
| JP2152764A | ||||
| JP58177270A | ||||
| JP8071927A | ||||
| JP1117856U | ||||
| JP8318459A |
Attorney, Agent or Firm:
Hidemi Aoki
Hiroshi Yamano
Hiroshi Yamano