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Title:
METHOD FOR CUTTING STONE BY DIAMOND CHIP SAW
Document Type and Number:
Japanese Patent JPH05337932
Kind Code:
A
Abstract:

PURPOSE: To accurately bite and cut without slowing sending speed of a band by forming a guide layer with soft material on a front side of a work in the biting direction when cutting is performed by letting a running diamond chip saw bite the work of stone.

CONSTITUTION: As for material and thickness of a guide layer 13, a soft material into which a diamond chip 7 can bite easily and which can guide a band 5 is acceptable. When a running band 5 bites a work 11 having the guide layer 13, the biting can be performed accurately at a normal band conveying speed. Thereafter, a groove formed on the guide layer 13 plays a role of guide without generating clearances right and left, so that cutting is performed accurately along a cutting line.


Inventors:
OISHI SABURO
Application Number:
JP14776592A
Publication Date:
December 21, 1993
Filing Date:
June 08, 1992
Export Citation:
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Assignee:
OISHI ENG YUGEN
International Classes:
B23D55/08; B28D1/08; (IPC1-7): B28D1/08
Attorney, Agent or Firm:
Tatsuhiko Ishigaki



 
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