Title:
METHOD FOR CUTTING SUBSTRATE
Document Type and Number:
Japanese Patent JP2001338897
Kind Code:
A
Abstract:
To prevent a damage of each of electrodes provided on upper and lower surfaces of a substrate.
A method for cutting the substrate comprises the steps of coating adhesives 3 and 6 on the upper and lower surfaces of the substrate 4 having electrodes 4c on the upper and lower surfaces, then adhering the substrate 4 onto a stationary plate 2 by using the adhesive 3 of its lower surface side, and thereafter cutting the substrate 4 by a cutting means so as to arrive from the adhesive 6 side of the upper surface at the lower plate 2.
Inventors:
Endo, Kenichi
Application Number:
JP2000000157770
Publication Date:
December 07, 2001
Filing Date:
May 29, 2000
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B26D5/30; H01L21/301; H05K1/02; H05K3/00; B26D5/20; H01L21/02; H05K1/02; H05K3/00; (IPC1-7): H01L21/301; B26D5/30; H05K1/02; H05K3/00