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Title:
METHOD OF CUTTING WIDE AND THICK PLATE BY CIRCULAR SAW CUTTING MACHINE, AND CIRCULAR SAW CUTTING MACHINE SUITABLE FOR THE SAME
Document Type and Number:
Japanese Patent JP2012232367
Kind Code:
A
Abstract:

To accurately and efficiently cut out a blank with a width which is smaller than the overall length and the overall width of a work from a wide and thick plate using a circular saw cutting machine.

A work W is clamped by a conveying vice device 15, moved forward to a cutting line CL and positioned, fixedly clamped by a primary vice device 13, and cut out by a circular saw blade (primary finished product cutout step). The primary finished product W1 cut out through the primary finished product cutout step is taken out, and the conveying vice device 15 is moved back while the work W is being clamped (secondary machining preparation step). The primary finished product which is taken out is set in such a manner that the lateral one end face thereof abuts on the front end face of the uncut portion of the work W clamped by the conveying vice device 15 after the secondary machining preparation step, clamped by the primary vice device 15, and cut out by the circular saw blade (secondary finished product cutout step).


Inventors:
OKADA IKUO
Application Number:
JP2011101144A
Publication Date:
November 29, 2012
Filing Date:
April 28, 2011
Export Citation:
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Assignee:
NISHIJIMA CORP
International Classes:
B23D45/00; B23D47/04
Domestic Patent References:
JP2001513040A2001-08-28
JP2001170901A2001-06-26
JP4563507B12010-10-13
Attorney, Agent or Firm:
Yashiko Mori



 
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