To provide a method having better focus control.
A method for deciding exposure setting for a target field on a substrate in a lithography exposure process includes to provide calibration data by deciding a location of a calibration field in a first direction in a plurality of calibration locations in a second direction and a third direction in relation to the calibration field. Further, the method includes to provide production data by deciding a position of a target field on a substrate in the second and the third directions, and by measuring a position of an exposure field in the first direction in at least one measurement position in relation to the exposure field in the second and the third directions. Furthermore, the method includes: to perform comparisons between at least one first measured relative position and a plurality of relative calibration positions; and to use the comparisons for deciding the exposure setting on the basis of a measured position of the exposure field in the first direction and the calibration data, in relation to at least one relative calibration position in which the calibration data is different from at least one measured relative position.
RALPH BRINKHOF
STAALS FRANK
FRANKEN ROBERT
KOOP ERIK JOHAN
| JP2000323404A | 2000-11-24 | |||
| JP2000323404A | 2000-11-24 |
| WO2005088686A1 | 2005-09-22 | |||
| WO2005096354A1 | 2005-10-13 | |||
| WO2007097380A1 | 2007-08-30 | |||
| WO2005088686A1 | 2005-09-22 | |||
| WO2005096354A1 | 2005-10-13 | |||
| WO2007097380A1 | 2007-08-30 |
Toshifumi Onuki
Next Patent: JP2009188410