Title:
METHOD FOR DEPOSITING ELECTROLESS PLATING FILM
Document Type and Number:
Japanese Patent JP2001355075
Kind Code:
A
Abstract:
To provide a method for depositing an electroless plating film by which the deposition process of an electroless plating film is simplified, and also, the danger, e.g. of treating virulent poison is not accompanied at the time of the deposition.
After mixed hydroxide colloids 31 having a plurality of metallic hydroxides are adhered to a prescribed member 30, an electroless plating solution is fed to the above member.
Inventors:
FUJINO JUNJI
MURAKAMI KOHEI
HAYASHI OSAMU
HOSHINOUCHI SUSUMU
KAWASHIMA YASUO
MURAKAMI KOHEI
HAYASHI OSAMU
HOSHINOUCHI SUSUMU
KAWASHIMA YASUO
Application Number:
JP2001125698A
Publication Date:
December 25, 2001
Filing Date:
December 27, 1993
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C23C18/18; H01L23/36; H01L23/50; (IPC1-7): C23C18/18; H01L23/36
Attorney, Agent or Firm:
Masuo Oiwa (3 outside)