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Patent Searching and Data


Title:
METHOD FOR DEPOSITING SEMI-CONDUCTOR FILM ON INSULATING SUBSTRATE
Document Type and Number:
Japanese Patent JP2004090102
Kind Code:
A
Abstract:

To provide a method for depositing a semi-conductor thin film of uniform film thickness and excellent crystallinity on an insulating substrate.

The method for depositing the semi-conductor thin film on the insulating substrate comprises steps of: bonding a transfer substrate 10 having a semi-conductor substrate 12 and a transfer layer 15 which is located on a surface of the semi-conductor substrate 12 and includes a semi-conductor thin film layer 18 on the opposite side to the surface of the semi-conductor substrate 12 to an insulating substrate 22 on the semi-conductor thin film layer 18 side, and removing the semi-conductor substrate 12 side of the transfer substrate 10 bonded to the insulating substrate 22 to the semi-conductor thin film layer 18.


Inventors:
OGURA TSUTOMU
Application Number:
JP2002250815A
Publication Date:
March 25, 2004
Filing Date:
August 29, 2002
Export Citation:
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Assignee:
YAMATAKE CORP
International Classes:
B81C1/00; H01L29/84; (IPC1-7): B81C1/00; H01L29/84
Attorney, Agent or Firm:
Koji Nagato
Junichi Yamanaka