To provide a method for depositing a sputtered thin film onto a substrate, which achieves the stable preparation of a plurality of panels from one glass substrate without causing abnormal discharge or the like by a simple constitution, and a carrier for performing the method.
A carrier is composed of: a frame body in a square shape; and thin members connected between the opposite frame sides in the frame body via an elastic member and to which tension is applied. The thickness of each thin member is controlled to 0.1 to 0.8 mm; its thermal expansion coefficient is controlled to ±20% of the thermal expansion coefficient of a glass substrate to be formed into a substrate; the mounting face of the substrate is composed only of the thin members in such a manner that the frame body and the substrate are not contacted with each other, and each thin member has a function as a holding member for forming a state that the substrate is mounted on the carrier and a function as a mask member for defining two or more sputtered thin film forming regions in the substrate.
JO BINSEI
| JPH10152776A | 1998-06-09 | |||
| JP2002235165A | 2002-08-23 | |||
| JP2002363743A | 2002-12-18 | |||
| JP2000199046A | 2000-07-18 | |||
| JP2002031711A | 2002-01-31 |
Shinichi Abe
Yuji Tsujida
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